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Patent Searching and Data


Title:
LAYER FORMING METHOD BY CUTTING AND DEVICE THEREFOR
Document Type and Number:
Japanese Patent JPH08290347
Kind Code:
A
Abstract:

PURPOSE: To form three dimensional shape material with high accuracy in a short time by fabricating plate members into three dimensional shape by a tool according to a three-dimensional machining program prepared for every layer on the basis of three-dimensional numerical data.

CONSTITUTION: An adhesive is applied to the lower face of a second stage plate member 7 by an adhesive applying device 120 arranged on the way of conveyance. A table 114 is then moved up by a z-axis driving feed motion, and the upper face of a first stage plate member 2 through with machining is pressed to the lower face of the second stage plate member 7. In association with this, the second stage plate member 7 and the first stage plate member 2 through with machining on the upper face of the table 114 are integrally layered with the adhesive 8. After the suction force of a suction pad 122 is released to lower the table 114, a plate carrier 119 is moved into a delivery position to a plate stocker 118. The second stage plate member 7 is then machined by a tool according to a three-dimensional machining program in a layer corresponding to the second plate member 7.


Inventors:
OKAMOTO MITSURU
HONDA HISAYOSHI
Application Number:
JP12061395A
Publication Date:
November 05, 1996
Filing Date:
April 21, 1995
Export Citation:
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Assignee:
OSAKA KIKO CO LTD
International Classes:
B23Q15/00; B23Q35/00; B29C67/00; B32B37/00; (IPC1-7): B23Q15/00; B23Q35/00; B32B31/00