Title:
LAYOUT OF BONDING PAD USED FOR RADIALLY BONDED LEAD FRAME, ITS FORMATION METHOD, DIE MADE OF SEMICONDUCTOR AND INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JPH06168978
Kind Code:
A
Abstract:
PURPOSE: To provide a bonding pad layout which is allowed to be used for a radial bonding lead frame and capable of reducing an effective bonding pad pitch, while avoiding interferences between mutually adjacent bonding wires. CONSTITUTION: Two arrays of bonding pads 704 are arranged around a semiconductor-made die 701. A bonding pad pitch 701B of an outer array 708 is different from a bonding pad pitch 710A of an inner array 707. The bonding pad pitch of the one array is fixed, and that of the other array is changed along the sides of the die. Consequently, an interval between mutually adjacent bonding wires 706 is suitably and fixedly maintained, so that interferences between mutually adjacent bonding wires 706 or interference between a bonding wire 706 in a bonding process and a wire bonding device can be avoided.
Inventors:
MAIKERU DEII KUZATSUKU
JIEFURII JII HOROUEI
JIYONASAN SHII PAAKU
DARIRU BUI ASHIYUTON
EBURIN ERU JIEIKOBUSON
JIYON EI RAITO
JIEFURII JII HOROUEI
JIYONASAN SHII PAAKU
DARIRU BUI ASHIYUTON
EBURIN ERU JIEIKOBUSON
JIYON EI RAITO
Application Number:
JP20348793A
Publication Date:
June 14, 1994
Filing Date:
August 17, 1993
Export Citation:
Assignee:
AMERICAN MICRO SYST
International Classes:
H01L21/60; H01L23/485; H01L23/50; (IPC1-7): H01L21/60; H01L23/50
Attorney, Agent or Firm:
Shusaku Yamamoto