PURPOSE: To prevent the warp of a substrate and improve reliability, by mounting a light transparent substrate on a reflecting table, and curing resin with the reflected light.

CONSTITUTION: A glass substrate 10 is mounted on a table 25 having a reflecting surface 26. The semconductor chip mounting region is coated with ultraviolet- curing resin 27, and a semiconductor chip is mounted on the mounting region. Metal protrusions 29 of the semiconductor chip 28 are aligned to a wiring part. From above the semiconductor chip 28, pressure is applied by a pressing jig 30. The ultraviolet-curing resin 27 is pressed and spread, and the metal protrusions 29 are electrically connected with the wiring part. After that, in this state, the ultraviolet-curing resin 27 is irradiated with ultraviolet rays. As to the irradiation, the wavelength in the vicinity of 360nm out of main wavelengths of a mercury xenon lamp is most effective. The light of the above wavelength penetrates the glass substrate 10, and is reflected by the reflecting surface. The reflected light again penetrates the glass substrate 10, and the ultraviolet-curing resin 27 is irradiated with the reflected light. Thereby the conventional aperture part of a table which part corresponds to the semiconductor chip region is made unnecessary.