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Patent Searching and Data


Title:
LEAD-FRAME FEED DEVICE
Document Type and Number:
Japanese Patent JPH04299850
Kind Code:
A
Abstract:

PURPOSE: To obtain a device which can beforehand prevent a lead frame from being deformed when the lead frame is fed to a die bonding process by a stacked and separating system by installing a detection means which detects the stripped state or the held state of the lead frame at a point of time when the lead frame is stripped or at a point of time when it is held.

CONSTITUTION: A lead-frame stacked body 1 in which many lead frames RF have been stacked is held in such a way that its stacked face 1a is faced upward or obliquely upward; the lead frames RF are stripped one by one from the lead-frame stacked body 1 by using one pair of stripping means 3. Each lead frame RF is held by using one pair of chuck means 5 and is placed on a rail 4 for conveyance use to a next die-bonding process. At such a lead-frame feed device, detection means 6 which detect the stripped state or the held state of the lead frame RF at a point of time when the lead frame RF is stripped by the stripping means 3 or at a point of time when it is held by the chuck means 5 are installed.


Inventors:
MIYASHITA YASUTERU
Application Number:
JP6467291A
Publication Date:
October 23, 1992
Filing Date:
March 28, 1991
Export Citation:
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Assignee:
SONY CORP
International Classes:
H01L23/50; (IPC1-7): H01L23/50
Attorney, Agent or Firm:
Hidekuma Matsukuma