Title:
LEAD FRAME FOR LED PACKAGE, LED PACKAGE, AND LED LIGHT EMITTING ELEMENT USING THE SAME
Document Type and Number:
Japanese Patent JP2013229355
Kind Code:
A
Abstract:
To provide a lead frame for an LED package capable of increasing strength of light radiated from the LED package by making the lead frame function as a reflector, an LED package, and a light emitting element using the same.
A lead frame for an LED package comprises: an LED element locating section 221; a first lead frame 101 having a first reflector standing from one end of the locating section 221 and a second reflector standing from the other end; and a second lead frame 102 having a middle level plane, and a third reflector standing from the middle level plane. The middle level plane is positioned between a locating plane side end of the first lead frame 101 and the opposite other end.
Inventors:
TOYODA HIDEKI
UTSUNOMIYA WATARU
INOUE HIDEFUMI
SEKI NORIAKI
SHUDO SHINJI
UTSUNOMIYA WATARU
INOUE HIDEFUMI
SEKI NORIAKI
SHUDO SHINJI
Application Number:
JP2012098439A
Publication Date:
November 07, 2013
Filing Date:
April 24, 2012
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
H01L33/60; H01L33/62
Attorney, Agent or Firm:
Hiroki Naito
Daisuke Nagano
Kentaro Fujii
Daisuke Nagano
Kentaro Fujii
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