Title:
LEAD FRAME, AND PLATING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP3916586
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a lead frame in which the generation of cracks is suppressed on bending, and which is excellent in adhesion with a mold resin, and to provide a plating method therefor.
SOLUTION: In the lead frame in which a noble metal plating layer 13 is formed on the surface of a metal stock 100 via substrate plating layers, the substrate plating layers are formed by a smooth Ni plating layer 11 plated on the metal stock 10 by using a direct electric current or a pulse current having no polarity inversion components, and a roughened Ni plating layer 12 plated on the smooth Ni plating layer 11 by using an electric current including a polarity inversion pulse.
Inventors:
Li Ming
Yamaura Daigo
Yamaura Daigo
Application Number:
JP2003139114A
Publication Date:
May 16, 2007
Filing Date:
May 16, 2003
Export Citation:
Assignee:
Mitsui High Tech Co., Ltd.
International Classes:
C25D5/14; C25D5/18; C25D7/00; C25D7/12; H01L23/50; (IPC1-7): C25D5/14; C25D5/18; C25D7/12; H01L23/50
Domestic Patent References:
| JP62278293A | ||||
| JP2001210932A | ||||
| JP3259894B2 | ||||
| JP61166995A | ||||
| JP9148508A | ||||
| JP11274177A | ||||
| JP10068097A | ||||
| JP7138797A | ||||
| JP55058389A | ||||
| JP2000077594A | ||||
| JP2002299538A | ||||
| JP8503522A |
Attorney, Agent or Firm:
Fujio Nakamae