To provide a lead frame that enables the runners to be punched out without changing the existing production equipment for special treatment (partial plating, taping and laser treatment) and deforming the lead frame, and a method for manufacturing the same.
This lead frame for resin-sealed semiconductor device 1 consists of a resin sealing part covered by a sealing resin and provided with semiconductor devices, and a runner 30 facing the runners for guiding the sealing resin to the resin sealing part, and the surface roughness of the runner 30 is made smaller than that of any part other than the runner 30 of the lead frame 1. In this way, the sealing resin facing the runner 30 of the lead frame 1 can be easily punched out and the deformation of the lead frame 1 can be prevented.
SHIMIZU YOSHIAKI
Yoshihiro Morimoto
Toshiji Sasahara
Yohei Harada
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