Title:
LEAD FRAME FOR SEMICONDUCTOR DEVICE AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JP3019046
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent the leakage current from flowing via the adhesive between the adjacent inner leads in the lead frame.
SOLUTION: The adhesive 3 is applied on the insulating tape 1 in the form of fine particles, then the fine particles of adhesive are utilized to fix the inner leads 2 on the insulating tape 1. The adhesive is applied in the form of fine particles and the diameter is set smaller than the dimension between the adjacent inner leads 2 and 2 whereby the adjacent inner leads can avoid from being integrally jointed to each other via the adhesive leaking out, and the occurrence of leaking current between adjacent leads can be inhibited that is caused by the ionic contaminants liberating from the insulating tape.
Inventors:
Hiroshi Koizumi
Application Number:
JP31813097A
Publication Date:
March 13, 2000
Filing Date:
November 19, 1997
Export Citation:
Assignee:
NEC
International Classes:
C09J7/02; C09J9/00; H01L23/50; (IPC1-7): C09J7/02; C09J9/00; H01L23/50
Domestic Patent References:
| JP61276344A | ||||
| JP527034U |
Attorney, Agent or Firm:
Naka Kanno