Title:
LEAD FRAME FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH07202105
Kind Code:
A
Abstract:
PURPOSE: To obtain a resin-sealed semiconductor device with a structure of a stable die pad to prevent stay shift difficult by reinforcing a suspension lead.
CONSTITUTION: In a semi-lead frame 10 equipped with a suspension lead 3 and the like connecting, to a stay, each corner of a plurality of inner leads 2 and a die pad 1, which are provided with an inner part arranged at a preset space along the perimeter which is at a preset space from a perimeter of the die pad 1 having a plurality of corners, each suspension lead 3 is connected by beams 6A, 6B, 6C, and 6D between the die pad 1 and each inner lead 2, and a suspension lead 2 is connected to the inner leads 2 on both sides by arms 7A and 7B.
Inventors:
MAKINO HARUHIKO
Application Number:
JP33865693A
Publication Date:
August 04, 1995
Filing Date:
December 28, 1993
Export Citation:
Assignee:
SONY CORP
International Classes:
H01L23/28; H01L21/56; H01L23/50; (IPC1-7): H01L23/50; H01L21/56; H01L23/28
Attorney, Agent or Firm:
Mitsuo Takahashi
Previous Patent: Production control system, production system and program
Next Patent: SEMICONDUCTOR DEVICE AND ITS MANUFACTURING DEVICE
Next Patent: SEMICONDUCTOR DEVICE AND ITS MANUFACTURING DEVICE