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Patent Searching and Data


Title:
LEAD FRAME FOR SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JPS6018944
Kind Code:
A
Abstract:

PURPOSE: To reduce the common impedance section of leads to the possible minimum by forming a stepped section to a stitch section, forming the stitch in L-shaped or T-shaped structure and contain the leads divided up to their midways by slits.

CONSTITUTION: Stitch sections 206b, 206c are formed to a T shape to an external leading-out section in a lead 206 in leads 101W105 and 206 and 107W111. The stitch sections 206b, 206c are divided into two sections of 206b and 206c by a slit 100 from the stitch section side. The stitck sections divided into two sections are pressed so as to be made lower than the surfaces on which other leads 101W105, 107W111 are positioned. The stitch sections corresponding to T- shaped cross-bars are arranged along one side of an island as a fitting section for a pellet for the convenience of wirings, thus constituting a lead frame. Accordingly, the common impedance sections of the leads can be reduced without excessively requiring the number of the leads and drawing around the wirings for the pellet.


Inventors:
TANABE KOUICHI
Application Number:
JP12673483A
Publication Date:
January 31, 1985
Filing Date:
July 12, 1983
Export Citation:
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Assignee:
NIPPON ELECTRIC IC MICROCOMPUT
International Classes:
H01L23/50; H01L23/495; (IPC1-7): H01L23/48
Attorney, Agent or Firm:
Shin Uchihara