LEAD-FREE METALLIC MATERIAL FOR ELECTRONIC COMPONENT

Title:

LEAD-FREE METALLIC MATERIAL FOR ELECTRONIC COMPONENT

Document Type and Number:

Japanese Patent JP2007196289

Kind Code:

A

Abstract:

To provide a lead-free metallic material for an electronic component that has excellent oxidation resistance and is suitable as a lead-free solder and a lead-free plating material.

The lead-free metallic material for an electronic component is composed of an Sn-base alloy comprising, by weight, 0.005 to 2.0% Ta. The lead-free solder is composed of an Sn-based alloy comprising 0.005 to 2.0% Ta. The lead-free plating material is composed of an Sn-base alloy comprising 0.005 to 2.0% Ta. The lead-free solder further comprises additional elements selected from Zn, Bi, In, Cu and Ag, and at least one kind of additional element selected from Co, Ti, Ni, Pd, Sb and Ge as well. The lead-free plating material comprises In, and further comprises at least one of additional element selected from Ag, Cu and Zn.

More Like This:

WO/2009/111932	LEAD-FREE HIGH-TEMPERATURE ELECTRONIC SOLDER AND PREPARING METHOD THEREOF
JP3797990	THERMOSETTING FLUX AND SOLDER PASTE
WO/2014/057261	LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES

Inventors:

KURI YUJI
TAN TORONRON

Application Number:

JP2006329712A

Publication Date:

August 09, 2007

Filing Date:

December 06, 2006

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TOSHIBA CORP

International Classes:

B23K35/26; C22C12/00; C22C13/00; C22C13/02; H05K3/34; B23K35/40

Attorney, Agent or Firm:

Kenji Yoshitake
Yukitaka Nakamura
Konno Akio
Noritaka Yokota

Previous Patent: METHOD FOR MANUFACTURING CAST BODY FOR LEAD BATTERY

Next Patent: METHOD FOR MANUFACTURING PIPE MADE OF VIBRATION DAMPING STEEL SHEET BY DRAWING PROCESS, AND PIPE MAD...