Title:
LEAD INSERTION PART WITH BUMP AND BUMP MOUNTING METHOD
Document Type and Number:
Japanese Patent JP2000196231
Kind Code:
A
Abstract:
To raise hybrid mounting property by providing a lead insertion part with a bump which enables soldering with a plane mounting part at once by a reflow method.
A solder bump 4 is provided in the middle of a lead 3 of a lead insertion part 1. When the part 1 is mounted on a circuit board 5 by inserting the lead 3 to a lead insertion hole 6 of the circuit board 5, the solder bump 4 is pressed to a mouth part of the lead insertion hole 6 and mounting state of the part 1 is stabilized. Then, the solder bump 4 is molten in a reflow furnace and molten solder is made to flow into the lead insertion hole 6, thus fixing the lead 3 to the circuit board 5.
Inventors:
YAMANOUCHI TAKETOMO
Application Number:
JP37656398A
Publication Date:
July 14, 2000
Filing Date:
December 24, 1998
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
B23K1/00; H01L23/50; H05K3/34; (IPC1-7): H05K3/34; B23K1/00; H01L23/50; H05K3/34
Attorney, Agent or Firm:
Nobuo Kaida (3 outside)
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