Title:
SOLDERING METHOD AND SOLDERING DEVICE
Document Type and Number:
Japanese Patent JP2000196232
Kind Code:
A
Abstract:
To provide a soldering method and soldering device for preventing soldering defect and soldering a flexible circuit board and an electric part stably and property.
Soldering is carried out by using far-infrared radiation as heat ray, forming an irradiation hole 21 large enough to irradiate an entire of an electric part 3 including at least a soldering part 4 by heat ray irradiation and irradiating an entire of the electric part 3 including the soldering part 4 with far-infrared radiation.
Inventors:
TAKAHIRA HIROSHI
IMAI MAKOTO
TAKAHASHI KENICHI
IMAI MAKOTO
TAKAHASHI KENICHI
Application Number:
JP37464898A
Publication Date:
July 14, 2000
Filing Date:
December 28, 1998
Export Citation:
Assignee:
OPTREX KK
NIPPON SEIKI CO LTD
NIPPON SEIKI CO LTD
International Classes:
B23K1/00; B23K1/005; B23K1/008; H05K3/34; B23K101/42; (IPC1-7): H05K3/34; B23K1/00; B23K1/005; B23K1/008
Attorney, Agent or Firm:
Shunsuke Nakao (2 outside)