Title:
LEAF-SHAPED HEAT PIPE
Document Type and Number:
Japanese Patent JP2017083042
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To solve problems when cooling an electronic component of high heat density in limited space conditions in which a conventional thermal diffusion board using the heat conduction in the in-plane direction is insufficient in the temperature equalization in equipment and a temperature rise becomes the problem, by providing a leaf-shaped heat pipe that diffuses and dissipates local overheating by heat density transfer function of an operation/heat transfer mechanism of a micro-area and achieves low-temperature cooling in the equipment, and providing a leaf-shaped heat pipe in which metal coating is coated on an inner wall surface of an aluminum chamber for weight reduction.SOLUTION: A leaf-shaped heat pipe is constituted of: liquid passageway means of a three-dimensional protrusion 7a arranged in an inner wall surface for maintaining the working fluid 6 in a chamber 2 in an inner wall surface and moving the condensed working fluid in the direction perpendicular or oblique to a longitudinal axis; and vapor flow path means of vapor space flow path 8a oppositely formed by the three-dimensional protrusion 7a for moving the vaporized working fluid in the direction perpendicular or oblique to the longitudinal axis, and of a flow path 9a of a circular arc cross-sectional shape separated in the inner wall surface and increased in the diameter.SELECTED DRAWING: Figure 1
Inventors:
ITO AKIRA
Application Number:
JP2015209495A
Publication Date:
May 18, 2017
Filing Date:
October 26, 2015
Export Citation:
Assignee:
ITO SATOMI
KATSUUMI TSUTOMU
KATSUUMI TSUTOMU
International Classes:
F28D15/04; F28D15/02; F28F19/06; F28F21/08; H01L23/427; H05K7/20