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Title:
LED EPITAXIAL WAFER, AND LED MANUFACTURED USING SAME
Document Type and Number:
Japanese Patent JP2008147504
Kind Code:
A
Abstract:

To provide an LED epitaxial wafer which has a uniform luminance characteristic distribution in a wafer surface even when the number of times of crystal growth becomes large and deposits stick on a holder, and to provide an LED manufactured using the same.

The LED epitaxial wafer is constituted by providing, on a substrate 2, an active layer 6 which emits light, a light guide-out surface for guiding the light emitted by the active layer 6 out, and a DBR layer 4 which is provided between a substrate 2 and the active layer 6 for reflecting the light emitted by the active layer 6 to the light guide-out side. The DBR layer 4 is so designed that a reflection wavelength of the DBR layer 4 becomes equal to a light emission wavelength of the active layer 6 on a wafer outer peripheral side, and then formed so that the difference between the light emission wavelength of the active layer 6 and the reflection wavelength of the DBR layer 4 becomes minimum on the wafer outer peripheral side.


Inventors:
WATANABE NAOYUKI
Application Number:
JP2006334529A
Publication Date:
June 26, 2008
Filing Date:
December 12, 2006
Export Citation:
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Assignee:
HITACHI CABLE
International Classes:
H01L33/06; H01L33/30
Domestic Patent References:
JP2008071820A2008-03-27
Attorney, Agent or Firm:
Nobuo Kinutani