To enable restrictive injection of an expensive LED chip sealing resin, while adopting a metal-formed lead frame structure as an LED chip package substrate.

A lead frame includes: a main body for mounting the LED chip thereon; and a pair of wall portions positioned on both sides of the main body and extending to the identical side of the light emitting direction of the LED chip in the direction orthogonal to the main body. The pair of wall portions is mutually separated by an opening that separates the lead frame, so as to function as a pair of connection electrodes. By the fixation of the LED chip to the front surface of the lead frame main body, each connection electrode of the LED chip is connected to each separated lead frame. By using a transparent resin, resin sealing is made into a space between the wall portions on both sides of the lead frame. An insulating layer is adhered to the back face of the lead frame by an adhesive agent.