To assure heat radiation performance of a substrate if a cover member is formed at a solid-state light-emitting element attached to the substrate.

A light-emitting module 12 comprises a plurality of LED chips 21 attached to the surface of a wiring board 20, and a plurality of lenses 30 which covers the LED chips 21. On the wiring board 20, a plurality of gate holes 27 penetrating its front and rear sides, as well as runners 26 formed to pass the plurality of gate holes 27 on the rear side of the wiring board 20 are provided. By injection-molding the resin for a lens through the runners 26 and the gate holes 27, a plurality of lenses 30 is formed on the front surface of the wiring board 20, while a connection part 31 integrated with the lens 30 is formed in the gate hole 27, and a support part 32 integrated with the connection part 31 is formed in the runner 26. Here, the support part 32 is formed in a way that it avoids a through hole 28 which is a heat transfer part from the LED chips 21.