Title:
LIGHT-EMITTING DIODE DEVICE NOT REQUIRING PACKAGE PROCESS NOR CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2014146794
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To achieve the effect of enhancing the reliability and yield while reducing the cost, by simplifying the element constitution and package process and assembly process to a minimum.SOLUTION: In a light-emitting diode device not requiring a package process nor a circuit board, and a manufacturing method therefor, any substrate for semiconductor package and a printed circuit board are not required. Mainly, two electrodes and one or a plurality of chip elements that can be connected externally by means of wires are provided on a light-emitting diode chip. The two electrodes are conducted by being connected electrically and directly with a DC power supply or an AC power supply by means of wires, and light is emitted from the light-emitting diode.
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Inventors:
WANG CHUNG-LIN
Application Number:
JP2014007796A
Publication Date:
August 14, 2014
Filing Date:
January 20, 2014
Export Citation:
Assignee:
WANG CHUNG-LIN
International Classes:
H01L33/62
Domestic Patent References:
| JP2008505478A | 2008-02-21 |
Attorney, Agent or Firm:
Yamaguchi new moon -- student
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