To provide an LED package in which an ESD protection part does not exert an influence on emission intensity and an optical form of the LED package.
The light emitting diode (LED) package comprises a carrier, a package housing, an LED chip, and the electrostatic discharge protection (ESD protection part). The package housing covers a part of the carrier, and provides a chip housing space over the carrier. The LED chip which is arranged on the carrier and positioned in the chip housing space is electrically connected to the carrier. The ESD protection which is arranged on the carrier and covered by the package housing is electrically connected to the carrier. Since light emitted from the LED chip is not absorbed by the ESD protection covered by package housing, the LED package has superior emission intensity. Further, the method is provided for manufacturing the LED package.
COPYRIGHT: (C)2007,JPO&INPIT
YO KOKUJI
HO KUNG-CHI
TSAI HU-CHEN
WANG WEN-CHUAN
| JP2002124703A | 2002-04-26 | |||
| JP2005244220A | 2005-09-08 | |||
| JP2006093697A | 2006-04-06 | |||
| JP2007150229A | 2007-06-14 | |||
| JP2006339640A | 2006-12-14 |
Hideka Tanaka
Yoshiyuki Shiraishi
Kunihiko Shiromura
Tsuyoshi Kumano