LIQUID COATING METHOD, LIQUID COATING DEVICE, AND COMPUTER-READABLE RECORDING MEDIUM

Japanese Patent JP2016010796

A

PROBLEM TO BE SOLVED: To further uniformize thickness of a coating film formed on a surface of a substrate.SOLUTION: A liquid coating method includes: a process of coating a surface Wa of a wafer W with a coating liquid spirally by discharging the coating liquid from a nozzle N while moving the nozzle N in a predetermined direction along the surface Wa of the wafer W between a rotation axis of the wafer W and a peripheral edge of the wafer W during rotation of the wafer W; a process of maintaining linear speed in a discharge position approximately constant by reducing rotation speed of the wafer W as a discharge position of the coating liquid from the nozzle N on the surface Wa of the wafer W is positioned closer to a peripheral edge side of the wafer W; and a process of maintaining a discharge flow rate of the coating liquid discharged from the nozzle N approximately constant by changing a gap between a discharge port of the nozzle N and the surface Wa of the wafer W based on a flow rate of the coating liquid before discharged from the nozzle N.

ICHINO KATSUNORI
ISHII TAKAYUKI
KAWAHARA KOZO
SHIMOKAWA DAISUKE
TASHIRO KAZUYUKI

JP2015041553A

January 21, 2016

March 03, 2015

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TOKYO ELECTRON LTD

B05D1/26; B05C5/02; B05C11/10; H01L21/027

JP2005046694A	2005-02-24
JP2002126602A	2002-05-08
JP2014008425A	2014-01-20
JP2004089762A	2004-03-25
JPH0655129A	1994-03-01

Yoshiki Hasegawa
Yoshiki Kuroki
Junji Kashiwaoka
Toshiaki Matsuzawa

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