Title:
LIQUID DRAINING DEVICE, ELECTRIC PLATING APPARATUS AND PRODUCTION METHOD OF COPPER-CLAD LAMINATED RESIN FILM
Document Type and Number:
Japanese Patent JP2015199989
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a liquid draining device capable of preventing residue of a plating liquid.SOLUTION: A liquid draining device includes a nip roll 52 nipping vertically a copper thin film-provided long film F carried and a conveyance roll 51. A groove 53 along the circumferential direction is formed on the end side, with respect to the contact surface with the copper thin film-provided long film F, of the outer peripheral surface, in both end parts, of the conveyance roll 51. A plating liquid spread through pressing by the nip roll 52 and the conveyance roll 51 flows into the groove 53 of the conveyance roll 51 and falls down, leading to prevention of spreading and residue of the plating liquid on the end side with respect to the groove 53 and thus prevention of drying and crystallization of residual plating liquid.
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Inventors:
SHIRAISHI AKINORI
Application Number:
JP2014079554A
Publication Date:
November 12, 2015
Filing Date:
April 08, 2014
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
C25D7/06; C25D21/00
Domestic Patent References:
| JPH0314154U | 1991-02-13 | |||
| JP2000079353A | 2000-03-21 | |||
| JPH0892779A | 1996-04-09 | |||
| JP2012001793A | 2012-01-05 |
Attorney, Agent or Firm:
Yamauchi Patent Office
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