Title:
LIQUID EPOXY RESIN COMPOSITION FOR SEALING AND CURED MATERIAL THEREOF
Document Type and Number:
Japanese Patent JP3633674
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a sealing epoxy resin composition having low viscosity and excellent in heat and moisture resistances by using an epoxy resin, a specified allylated phenol resin and a cure accelerator as the constituents.
SOLUTION: This composition is obtained by blending an epoxy resin with an allylated phenol resin comprising an allylated novolak phenol resin which contains at most 10 area% allylated phenol aralkyl resin and/or binuclear components, in which trinuclear components account for at least 50 area% of the remaining part excluding the binuclear components and in which the total of the trinuclear component content and the tetranuclear component content is at least 75 area% in an amount sufficient to provide a stoichiometric ratio of the hydroxy groups to the epoxy groups of the epoxy resin of (0.2 to 2):1 and at least one cure accelerator selected from the group consisting of organophosphine compounds and nitrogen-containing cyclic compounds in an amount of 0.01-10 pts.wt. based on 100 pts.wt. epoxy resin.
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Inventors:
Tomoyuki Kawabata
Yuzo Ono
Yuzo Ono
Application Number:
JP18250395A
Publication Date:
March 30, 2005
Filing Date:
July 19, 1995
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08G59/62; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/62; H01L23/29; H01L23/31
Domestic Patent References:
| JP63083035A | ||||
| JP62246920A | ||||
| JP61287952A | ||||
| JP48072293A | ||||
| JP7206997A | ||||
| JP7118367A | ||||
| JP6192361A | ||||
| JP6145304A | ||||
| JP5320317A | ||||
| JP5287053A | ||||
| JP4225012A | ||||
| JP3166221A |
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