Title:
LIQUID INJECTION HEAD, AND LIQUID INJECTION DEVICE
Document Type and Number:
Japanese Patent JP2014188814
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a liquid injection head and a liquid injection device which can securely and solidly connect a terminal of a wiring member and a terminal of pressure generating means while preventing a defect such as contact failure and short circuit.SOLUTION: A flexible cable 39 includes a part covered by solder resist 56, and an exposed part 58 which is not covered by the solder resist. The exposed part includes a wiring terminal 53, and continues to an outer side position from at least an opening on a wiring member insertion side of a wiring space part 38 in a state that the wiring terminal and an element terminal on a piezoelectric element 19 side are connected. A filler 60 having an electrical insulation property is filled in the wiring space part in a state that a junction part of the element terminal and the wiring terminal in the wiring space part is covered and in a state that a protective substrate 24 for defining the wiring space part and the exposed part of the flexible cable are not in contact.
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Inventors:
KINOSHITA RYOTA
OKUI HIROAKI
WATANABE SHUNSUKE
YAMADA HITOSHI
FURUTA TADAO
OKUI HIROAKI
WATANABE SHUNSUKE
YAMADA HITOSHI
FURUTA TADAO
Application Number:
JP2013065814A
Publication Date:
October 06, 2014
Filing Date:
March 27, 2013
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B41J2/045; B41J2/055; B41J2/16
Domestic Patent References:
| JP2011067998A | 2011-04-07 | |||
| JP2011216761A | 2011-10-27 | |||
| JP2007055221A | 2007-03-08 | |||
| JP2005297298A | 2005-10-27 |
Attorney, Agent or Firm:
Masaaki Kamiyanagi
Kazuhiko Miyasaka
Kazuaki Watanabe
Kazuhiko Miyasaka
Kazuaki Watanabe