To provide a liquid state resin composition for sealing a semiconductor, excellent in low stress property and low arching property.

This liquid state resin composition comprises (A) an epoxy resin having ≥2 glycidyl groups and ≥1 glycidylaniline groups in 1 molecule, and being a liquid state at a normal temperature, (B) an epoxy resin being a liquid state at the normal temperature, (C) a silicone-modified liquid state epoxy resin having a siloxane structure, (D) a liquid state polyphenol, (E) a curing accelerator and (F) an inorganic filler. Also, the semiconductor device by using the above liquid state resin composition is provided.