To eliminate or reduce contaminating a photosensitive surface of a substrate by falling of particulates onto a substrate, when a mask is loaded, which mechanically masks the substrate and forms an region excluded from exposure.

This method removes the substrate from a substrate table of a lithography device. The mask for forming a periphery region excluded from exposure on the substrate is provided on the substrate table. The method includes moving the mask from a using position to an storage position. The storage position adjoins a projection system of the lithography device. Moreover, the method includes removing the substrate from the lithography device.