Title:
LOW PROFILE CONNECTOR AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2013025998
Kind Code:
A
Abstract:
To provide a manufacturing method of a low profile connector in which existing terminals can be used without requiring a protector and a large space.
An insulation coating H is removed N1, N2 from a part bent by the press working of a wire W subjected to the insulation coating H, and the wire W is subjected to the press working and formed into a predetermined shape. A plurality of insulation coating peeled wires having a tip W1 to which a terminal T is bonded are juxtaposed. From the bonding part of each terminal of the plurality of insulation coating peeled wires to each part where the insulation coating is removed is surrounded and molded integrally to constitute a housing M.
Inventors:
KATO HAJIME
KATAOKA MASAYUKI
KOMATSU HIROKI
INNAMI TAKESHI
KATAOKA MASAYUKI
KOMATSU HIROKI
INNAMI TAKESHI
Application Number:
JP2011159124A
Publication Date:
February 04, 2013
Filing Date:
July 20, 2011
Export Citation:
Assignee:
YAZAKI CORP
International Classes:
H01R9/03
Domestic Patent References:
| JP2006123458A | 2006-05-18 | |||
| JP2006123458A | 2006-05-18 | |||
| JP2004281068A | 2004-10-07 |
Foreign References:
| WO2011019027A1 | 2011-02-17 | |||
| US5217388A | 1993-06-08 |
Attorney, Agent or Firm:
Hironori Honda
Toshimitsu Ichikawa
Toshimitsu Ichikawa