Title:
LUBRICANT COMPOSITION FOR WATER-SOLUBLE METAL PROCESSING
Document Type and Number:
Japanese Patent JP11080769
Kind Code:
A
Abstract:
To obtain the subject composition having a combination of chip dispersibility and defoamability by including a specific aromatic diamine- polyoxyalkylene adduct and/or specific alicyclic diamine-polyoxyalkylene adduct.
This composition is obtained by including pref. 1.5-40 wt.% of an aromatic diamine polyoxyalkylene adduct of formula I [R1 to R3 are each H or (A)m-H; A is an oxyalkylene or polyoxyalkylene; (m) and (n) are each ≥1] and/or an alicyclic diamine polyoxyalkylene adduct of formula II; wherein the (poly)oxyalkylene is pref. oxyethylene and/or oxypropylene, the addition number of moles being pref. 1-4. The compound(s) of formula I and/or formula II is incorporated pref. at 0.005-0.2 wt.% in a coolant.
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Inventors:
Ogino, Kyoko
Wakashiro, Shiyouji
Okugawa, Michihiko
Nakajima, Takashi
Wakashiro, Shiyouji
Okugawa, Michihiko
Nakajima, Takashi
Application Number:
JP1997000249593
Publication Date:
March 26, 1999
Filing Date:
August 29, 1997
Export Citation:
Assignee:
YUSHIRO CHEM IND CO LTD
International Classes:
C10M133/08; C10M149/14; C10M173/00; C10M173/02; C10N30/04; C10N30/18; C10N40/22; C10M133/00; C10M149/00; C10M173/00; C10M173/02; (IPC1-7): C10M133/08; C10M149/14; C10M173/00; C10M173/02
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