Title:
MATERIAL FOR Cu ALLOY TARGET, Cu ALLOY TARGET, Cu ALLOY FILM AND TOUCH PANEL
Document Type and Number:
Japanese Patent JP2015158003
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a Cu alloy film which is excellent in adhesiveness with a touch panel sensor substrate such as a resin-based film or a glass substrate while maintaining low electric specific resistance, and which has a low optical reflectance and is suitable as a sensor electrode or wiring of a touch panel, and to provide a material for a Cu alloy target and a Cu alloy target for producing such Cu alloy film, and a touch panel using the Cu alloy film.SOLUTION: The material for a Cu alloy target and a Cu alloy target contains 0.1≤Zn≤10.0at% and further 0.1≤Mg+Cr+Ca+Ti+Al+Sn+Ni+B≤6.0at%, and the balance Cu with inevitable impurities. The Cu alloy target is used for forming on a substrate a Cu alloy film used for a sensor electrode and/or wiring of a touch panel. The Cu alloy film consists of one produced by using the Cu alloy target. The touch panel has the Cu alloy film.
Inventors:
KAMIYA NAOHIDE
TAKO YUICHIRO
OZAKI KOZO
SAKAGUCHI KAZUYA
MINAMI KAZUKI
TAKO YUICHIRO
OZAKI KOZO
SAKAGUCHI KAZUYA
MINAMI KAZUKI
Application Number:
JP2014106012A
Publication Date:
September 03, 2015
Filing Date:
May 22, 2014
Export Citation:
Assignee:
DAIDO STEEL CO LTD
International Classes:
C22C9/04; C22C9/00; C22C9/01; C22C9/02; C22C9/06; H01B1/02; H01B5/14
Domestic Patent References:
| JP2013119632A | 2013-06-17 | |||
| JP2009185323A | 2009-08-20 | |||
| JP2008191541A | 2008-08-21 | |||
| JP2002294437A | 2002-10-09 | |||
| JP2012027159A | 2012-02-09 | |||
| JP2013540331A | 2013-10-31 |
Attorney, Agent or Firm:
Fumio Hatakeyama
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