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Title:
MAGNETIC TYPE PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP2008196918
Kind Code:
A
Abstract:

To provide a magnetic type pressure sensor formed by bonding surely a substrate having a magnetic resistance effect element with a substrate having a hard magnetic layer without performing high temperature processing.

This magnetic type pressure sensor is equipped with: a glass substrate 11 having a GMR element 12 provided on one main surface side; a silicon substrate 16 gold-tin eutectically bonded on one main surface of the glass substrate 11, and having the hard magnetic layer 20 oppositely to the GMR element 12; and a spacer 18 for partitioning a bonding area of the gold-tin eutectic bonding, and controlling an interval between the glass substrate 11 and a silicon substrate 16. The sensor is provided with an adhesiveness improving layer 19 on a gold-tin eutectically bonding domain on the silicon substrate 16 side.


Inventors:
FUKUDA TETSUYA
KIKUIRI KATSUYA
TAKAHASHI SATOSHI
MIYAJI SEI
SATO KIYOSHI
Application Number:
JP2007031224A
Publication Date:
August 28, 2008
Filing Date:
February 09, 2007
Export Citation:
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Assignee:
ALPS ELECTRIC CO LTD
International Classes:
G01L9/14
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki
Yoshimasa Okada