PURPOSE: To make it possible to reduce the whole area of the title manufacturing device when a plurality of vertical type diffusion furnaces are provided by a method wherein the furnace body is constituted in such a manner that a plurality of vertical type diffusion furnaces are vertically piled up.
CONSTITUTION: In the equipment wherein a semiconductor processing tube 3 is vertically placed and it is oxidized in an oxidizing furnace provided with a heating device on the outer circumferential surface, the thermally oxidizing furnaces are piled up vertically. As the furnace body part of a vertical type diffusion furnaces are piled up lengthwise as above-mentioned, the area of manufacturing equipmenht per piece can be made small, the cost of construction and operation expenses of the semiconductor device manufacturing line can be reduced, and the maintenance of the manufacturing line can also be made easier.
NAKAJIMA YUICHI
SHIMA YUKIO
Next Patent: METHOD OF DIFFRSING CD INTO INP SUBSTATE