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Title:
MANIFOLD, REFRIGERATOR, AND COOLING DEVICE WITH BUILT-IN THERMOELECTRIC MODULE
Document Type and Number:
Japanese Patent JPH11193986
Kind Code:
A
Abstract:

To provide a means for omitting the heat insulating treatment of a manifold, and to obtain a refrigerator which has a wide storage capacity inside, and which has a small entire shape.

In a refrigerator 70, a heat insulating material 83 at the upper part of the rear side of a refrigerator body 86 is removed in part, and a manifold 1 is mounted at the location. The manifold 1 forms the part of the wall of the refrigerator body 86. At the location where the manifold 1 is mounted, the inside and outside of the refrigerator body 86 is partitioned by having the manifold 1 as the boundary. The manifold 1 at the heat transfer surface side to be heated is exposed to the outside of the refrigerator body 86, and its heat transfer surface side to be cooled is inside the refrigerator.


Inventors:
SHIMADA MASUO
NAKAMOTO MASAFUMI
Application Number:
JP17805198A
Publication Date:
July 21, 1999
Filing Date:
June 09, 1998
Export Citation:
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Assignee:
MATSUSHITA REFRIGERATION
International Classes:
F25D11/00; F25B21/02; (IPC1-7): F25D11/00; F25B21/02
Attorney, Agent or Firm:
Takashi Fujita