Title:
MANUFACTURE OF CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3527667
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a ceramic electronic component which hardly causes shortcircuit defects.
SOLUTION: A plurality of ceramic sheets 10 formed of polyethylene and dielectric powder are prepared, and meanwhile metallic paste containing metallic elements, binder, plasticizer and solvent is prepared. Metallic paste is printed into a desired shape on a base film 12, wherein a release layer is formed and dried and a plurality of conductor layers 11 are formed. The conductor layer 11 is laminated together with the base film 12, so that the conductor layer 11 comes into direct contact with the ceramic sheet 10 on an ineffective layer formed by laminating and pressurizing a plurality of ceramic sheets 10, thereafter it is pressurized via the base film 12. The conductor layer 11 and the ceramic sheet 10 are adhered and the base film 12 is released from the conductor layer 11. The ceramic sheet 10 and the conductor layer 11 are mutually laminated and baked under the similar conditions, an outer electrode 3 such as copper is baked to both edge faces where the conductor layer 2 of a sintering body is exposed, plating is applied thereon, and a finished goods is obtained.
Inventors:
Nagai, Atsuo
Sakaguchi, Yoshiya
Miura, Katsuyuki
Kuramitsu, Hidenori
Sakaguchi, Yoshiya
Miura, Katsuyuki
Kuramitsu, Hidenori
Application Number:
JP21329799A
Publication Date:
May 17, 2004
Filing Date:
July 28, 1999
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01G4/12; H01G4/30; H05K3/20; H05K1/03; H05K3/46; (IPC1-7): H01G4/30; H01G4/12
Attorney, Agent or Firm:
岩橋 文雄 （外２名）
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