Title:
MANUFACTURE OF CHIP TYPE FUSE
Document Type and Number:
Japanese Patent JPH0696654
Kind Code:
A
Abstract:
PURPOSE: To provide a chip type fuse ensuring strong adhesion between a ceramic substrate and an electrode, and high solder heat resistance and productivity.
CONSTITUTION: A resist film 9 is formed between a conductor circuit 3 and an electrode laid on the surface of a ceramic substrate 2. Furthermore, a metal film having a low fusion point is formed on the upper surface of the circuit 3 and the electrode, and the exposed surface of the substrate 2 and the upper surface of the metal film are covered with a silicone film 10.
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Inventors:
HIROYAMA YUKIHISA
TAKEOKA TETSUO
MORITA HIROSHI
TAKEOKA TETSUO
MORITA HIROSHI
Application Number:
JP24197692A
Publication Date:
April 08, 1994
Filing Date:
September 10, 1992
Export Citation:
Assignee:
HITACHI KASEI CERAMICS KK
HITACHI CHEMICAL CO LTD
HITACHI CHEMICAL CO LTD
International Classes:
H01H69/02; H01H85/00; H01H85/02; H01H85/045; H01H85/046; H01H85/06; (IPC1-7): H01H69/02; H01H85/00
Attorney, Agent or Firm:
Kunihiko Wakabayashi
Next Patent: 加工性の良いエチレンプロピレンエラストマー