Title:
MANUFACTURE OF CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH01128490
Kind Code:
A
Abstract:
PURPOSE:To form a pattern on the side surface highly accurately and at a low cost by forming a groove at a conductor layer on the side surface connected to either the surface of substrate or the rear surface to separate conductors in terms of insulation. CONSTITUTION:In the formation of side surface pattern, a glass with round at the side surface and surface (or rear surface) of a ceramic is formed or a conductor film is formed on the surface (or rear surface) and side surface of a substrate of ceramic 1 by means of deposition or sputtering method etc. Then, a desired wiring pattern is formed on the surface (or rear surface) by etching etc. In this case, resist is applied to the entire surface of side surface to allow the conductor film to remain. And a groove is mechanically formed at a part which requires insulation. It allows the conductor film to be electrically isolated into plural parts and a wiring pattern to be formed.
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Inventors:
KONDO TAKESHI
IZUMI MAMORU
IZUMI MAMORU
Application Number:
JP28529487A
Publication Date:
May 22, 1989
Filing Date:
November 13, 1987
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H05K3/40; (IPC1-7): H05K3/40
Attorney, Agent or Firm:
Noriyuki Noriyuki (1 person outside)
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