Title:
MANUFACTURE OF DIAMOND HEAT SINK
Document Type and Number:
Japanese Patent JP3215644
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To avoid deteriorating metallized layers due to abrasion of a laser, by providing metallized layers on the upper and lower surfaces of a diamond and protective film as an upper layer, cutting a heat sink using a YAG laser, and removing the protective film.
SOLUTION: Metallized layers are provided on the upper and lower surfaces of a diamond, and a locally brazed or solder plated adhesive layer 2 is provided on its one surface metallized layers on the upper and lower surfaces of a diamond and protective film as an upper layer to form protective films on both surfaces thereof. The diamond is cut along parts 3 uncovered with the adhesive layer 2 which are wider than the cutting width by a YAG laser, and the protective film is removed. For cutting by the laser, the diamond can be cut without deteriorating the metallized layers due to abrasion of the laser.
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Inventors:
Koji Okada
Tanka Tsubun
Keigo Ehara
Tanka Tsubun
Keigo Ehara
Application Number:
JP2444397A
Publication Date:
October 09, 2001
Filing Date:
January 24, 1997
Export Citation:
Assignee:
TOYO KOHAN CO.,LTD.
International Classes:
H01L23/373; (IPC1-7): H01L23/373
Domestic Patent References:
| JP9186276A |
Attorney, Agent or Firm:
Akio Ohta
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