Title:
MANUFACTURE OF ELECTRONIC COMPONENT AND MANUFACTURE OF SURFACE ACOUSTIC WAVE DEVICE
Document Type and Number:
Japanese Patent JP3189719
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component formed by constituting first and second surface acoustic wave filter elements provided with the electrodes with different film thickness on the same substrate without lowering an yield.
SOLUTION: The first and second surface acoustic wave filter elements 1 and 2 with different electrode film thickness are formed on the same piezoelectric substrate 3. At the time, in the state where the electrode 1a of the first surface acoustic wave filter element 1 is formed on the piezoelectric substrate 3 and the electrode 1a is protected by the resist 6, the electrode 2a of the second surface acoustic wave filter element 2 is formed by photolithography and etching.
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Inventors:
Hideo Kito
Application Number:
JP34547896A
Publication Date:
July 16, 2001
Filing Date:
December 25, 1996
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K1/16; H01L41/09; H01L41/22; H03H3/08; H03H9/145; H05K3/02; H05K3/06; (IPC1-7): H03H3/08; H03H9/145
Domestic Patent References:
| JP6152299A | ||||
| JP6224678A | ||||
| JP62266907A | ||||
| JP60196007A | ||||
| JP5885616A |
Attorney, Agent or Firm:
Miya Saki Main tax (1 person outside)