Title:
MANUFACTURE OF ELECTRONIC PART
Document Type and Number:
Japanese Patent JP3304828
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing electronic parts wherein such area as can be used for forming an element on the surface of a unit substrate is wider while an electronic part having a desired performance is efficiently manufactured with no degraded connection reliability.
SOLUTION: With the use of a blade 11 comprising such inclined shape as of specified angle at a border part (shoulder part) 1c between an electrode allocation surface 1a and a cutting end surface 1b of a unit substrate 1 or at such part as to contact to a to-be-border part (shoulder part), at least a part of the unit substrate 1 is cut so that a slope 4 is formed at the border part (shoulder part) or the to-be-border part (shoulder part), thus a part of an electrode 2 (2a) is exposed above the slope 4.
Inventors:
Katsuji Matsuda
Kazuyoshi Uchiyama
Masahiko Kawaguchi
Katsuhiro Misaki
Naoki Iida
Kazuyoshi Uchiyama
Masahiko Kawaguchi
Katsuhiro Misaki
Naoki Iida
Application Number:
JP16952097A
Publication Date:
July 22, 2002
Filing Date:
June 10, 1997
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
B28D1/22; H01F27/29; H01F41/04; H05K1/02; H05K3/00; H05K1/03; (IPC1-7): H01F41/04; B28D1/22; H05K1/02
Domestic Patent References:
| JP839854A | ||||
| JP438406U | ||||
| JP6440505U |
Attorney, Agent or Firm:
Hitoshi Nishizawa
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