To provide a manufacturing method of a laminated electronic part with which manufacturing cost can be reduced by reusing a carrier film by a method wherein a green sheet can be pulled out without scratching the carrier film.

A cut line of rectangular profile is formed by penetrating a punching blade 3 to the depth which does not come into contact with the surface of a carrier film F to a ceramic green sheet S, and the ceramic green sheet Sa inside the cut line is taken out by attractingly holding it by an attraction head 2. As a result, the flaw which was conventionally generated, is not generated on the surface of the carrier film F in a process in which a ceramic green sheet Sa is pulled out. To be more precise, if the remains of the sheet of the carrier film F is removed after the ceramic green sheet Sa has been pulled out, the carrier film F can be reused, and the repeated use of the carrier film F greatly contributes to the reduction in manufacturing cost.