Title:
MANUFACTURE OF LEAD FRAME FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0411759
Kind Code:
A
Abstract:
PURPOSE: To give a stepped portion to an island part and a lead part, even when the lead part is complicated, and obtain a highly accurate lead frame by molding the fused frame material into a die.
CONSTITUTION: The fused lead frame material 3 is processed by an upper die 1 and a lower die 2 to form a lead frame. Since a lead frame can be manufactured by supplying lead frame material 3 into the die consisting of upper die 1 and lower die 2, the obtained lead frame has high accuracy. The stepped portion of the island part and lead part can be formed with high accuracy as designed.
More Like This:
Inventors:
ICHIYAMA HIDEYUKI
Application Number:
JP11477790A
Publication Date:
January 16, 1992
Filing Date:
April 28, 1990
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/50; (IPC1-7): H01L23/50
Attorney, Agent or Firm:
Masuo Oiwa (2 outside)
Next Patent: CLIP LEAD