PURPOSE: To provide a manufacturing method of a multilayer board which can cope with the compounding, systematization, and multifunctioning of each kind of electronic equipment by ensuring the highly accurate interlayer thickness and board thickness and highly accurate positional accuracy.

CONSTITUTION: When interposing a thermosetting adhesive sheet 4 where a reference hole larger in diameter than the reference hole 3 is bored between inner and outer layer printed wiring boards, where circuits 2 are formed in advance and a plurality of reference holes 3 are bored, and stacking and assembling them, the positioning is performed, using a columnar piece 5 having a collar at the center. The piece 5 is one to decide the interlayer thickness by the thickness of the collar, and the axis of the lower projection of the piece 5 where adhesives 6 are applied on both sides of the collar is inserted into the reference hole 3 of the lower inner/outer printed wiring board 1, and it is bonded. Then, the section of the collar is inserted into the reference hole of the thermosetting adhesive sheet, and further the axis of the upper projection is inserted into the reference hole 3 of the upper inner/outer printed wiring board 1, thus the decision of the interlayer thickness and the positing are performed, and they are stacked in order.