Title:
MANUFACTURE OF PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPS63283185
Kind Code:
A
Abstract:
A method of manufacturing printed circuit boards. An environmentally safe method for manufactured printed circuit boards using additive technology provides a simple and exact transfer of conductor patterns. The novel method provides a selective ablation of a nucleation, B, applied to a substrate either by itself or together with a thin base layer, G, applied by chemical metal deposition. This ablation is done by electromagnetic radiation preferably with an excimer laser in those regions of the substrate that do not correspond to the conductor tracks and/or interlayer connections or through-connections to be formed later. Conductor material is subsequently built up by chemical and/or galvanic metal deposition.
Inventors:
ANTOON MATERIN
Application Number:
JP9537288A
Publication Date:
November 21, 1988
Filing Date:
April 18, 1988
Export Citation:
Assignee:
SIEMENS AG
International Classes:
C23C18/16; C23C18/20; C23C18/30; C23C18/31; C23C18/40; C23F4/04; H05K1/03; H05K3/18; H05K3/42; (IPC1-7): C23C18/16; C23F4/04; H05K1/03; H05K3/18
Attorney, Agent or Firm:
Tomimura Kiyoshi
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