Title:
MANUFACTURE OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2004040082
Kind Code:
A
Abstract:
To provide a method for efficiently manufacturing a printed wiring board with unplated through hole, and to provide the flat and glossy printed wiring board.
This method comprises a step (a) for manufacturing a printed wiring base substrate with a through hole, a part of which is not metal-plated; a step (b) for cleaning the printed wiring base substrate in a cleaning bath containing one or more organic sulfur compound containing a divalent sulfur atom provided with a carbon-sulfur single crystal; a step (c) for microetching the cleaned printed wiring base substrate; and a step (d) for electroless-laminating a metal layer on the printed wiring base substrate.
Inventors:
LEUNG MEI KIU
LAI WILLETTA
CHENG PIT KAI PETER
LAI WILLETTA
CHENG PIT KAI PETER
Application Number:
JP2003103927A
Publication Date:
February 05, 2004
Filing Date:
April 08, 2003
Export Citation:
Assignee:
SHIPLEY CO LLC
International Classes:
C23C18/18; H05K3/24; H05K3/26; H05K3/38; H05K3/42; (IPC1-7): H05K3/26; C23C18/18; H05K3/42
Attorney, Agent or Firm:
Minoru Senda
Hisashi Tsuji
Koji Hashimoto
Hisashi Tsuji
Koji Hashimoto
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