PURPOSE: To prevent trouble due to moisture permeation by attaching benzotriazole or derivative thereof to a lead frame after a wire bonding process and molding the lead frame with a resin.
CONSTITUTION: An element 4 is die-bonded onto a tab 1 in a lead frame consisting of a Cu alloy. Electrodes on the element 4 and inner leads 2 in the lead frame are bonded by wires. Benzotriazole or derivative thereof is applied to the lead frame, and molded 8 with a resin. The surface of the Cu group lead frame is activated through heating in a reducing atmosphere in a wire bonding process, and a stable metallic compound film polymerizable with Cu is formed firmly by the application of benzotriazole or derivative thereof. Accordingly, adhesion with a resin mold is improved, and maintained stably for a prolonged term, thus inhibiting the intrusion of moisture and other noxious components from the outside.
| JPS60759 | SEMICONDUCTOR ELEMENT CARRIER |
| JPH05121627 | SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF |
| JPH0245968 | MANUFACTURE OF SEMICONDUCTOR DEVICE |
TANIGAWA TOORU
SUZUKI HIROKI
