Title:
MANUFACTURE OF SCANNING ELECTRON MICROSCOPE SYSTEM AND INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JP3720201
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method and system for analyzing a profile of wafer strength comprising a step where a wafer is scanned for generating a scan signal.
SOLUTION: Relating to a method and a system for analyzing a substrate (for example, 120), a step for scanning the substrate (for example, 120) is composed by generating a strength signal representing a general appearance of a wafer (for example, 120). As other elements contributing to the strength signal, chemical composition and electric state of a feature scanned on the substrate (for example, 120) may be listed. For evaluation of the substrate (for example, 120), the scanned signal is compared to a reference signal for correlation. Further, the method and system may be applied to a method for manufacturing a wafer (for example, 120) for improved manufacture quality of a product.
Inventors:
Britin Charles Khan
John Martin Mac Intosh
John Martin Mac Intosh
Application Number:
JP30347198A
Publication Date:
November 24, 2005
Filing Date:
October 26, 1998
Export Citation:
Assignee:
Lucent Technologies, Inc.
International Classes:
G01B15/04; G01N23/225; H01J37/28; H01L21/66; H01L21/822; H01L27/04; (IPC1-7): H01L21/66; G01N23/225; H01L21/822; H01L27/04
Domestic Patent References:
| JP6150866A |
Attorney, Agent or Firm:
Masao Okabe
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa
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