To simplify a process and to form a connection electrode for CSP implementation at a low cost by removing unwanted rearranged wiring electrode metal layer, except for a rearrangement wiring electrode pattern with an insulating film and connection electrode as masks.

A polyimide is coated as an insulating film (both as patterning mask and reinforcing layer) 5, so that it is formed only on a pattern which is to become an rearranged wiring electrode 4-b. Here, a polyimide is not formed where a connection electrode 6 is formed, with an electrode surface left exposed. In this condition, a solder ball used as the connection electrode 6 is printed to a prescribed position by screen printing. With an insulating film formed lastly as well as a solder ball as masks, a Cu which is an exposed rearranged wiring electrode metal layer and a barrier metal TaN (rearranged wiring electrode metal layer unwanted part 7) are removed by successive wet-etching.