PURPOSE: To remove a protective film and a residual substance of a protective tape without using an organic solvent which is harmful to the human body by a method wherein the protective film and the residual substance of the protective tape are removed (dry removal method) after these two have been made to react with active oxygen and have been carbonized.
CONSTITUTION: A wafer, where a residual substance 40 of a protective tape 4 remains after removal of the protective tape 4, is put in a reaction chamber 8 of an atmosphere of ozone (O3); ozone is irradiated with ultraviolet rays 9. Due to the irradiation with the ultraviolet rays 9, the ozone is divided into oxygen (O2) and active oxygen (O); the residual substance 40 and a protective film 3 are made to react with the active oxygen; they are carbonized and are then removed. Then, the wafer where the residual substance 40 and the protective film 3 have been removed is washed in water and is then dried. According to this invention, the residual substance of the protective tape 4 and the protective film 3 are made to react with the active oxygen; they are carbonized and are removed; accordingly, it is not required to use an organic solvent which is harmful to the human body when the residual substance of the protective tape 4 and the protective film are to be removed.
ARIMA JUNICHI
TAMAKI REIJI
TAKAGI HIROSHI
NAKAMURA MITSUYOSHI
KUROKI HIDEFUMI
