To obtain a solder ball with a specific deviation from spherical form by solidifying the liquid after keeping solder grains in a molten condition while the solder grains of a given area are floating or sinking in the liquid. The liquid is gently reserved, which is inactive against the solder and whose boiling point is higher than the melting point of the solder.

When a solder ball manufacturing device 1 is filled with liquid 10 to actuate a heater 5, the liquid 10 reserved in a melting/solidifying tank 2 gently, forms a heating zone 11 at the upper part and a cooling zone 12 at the lower part. Solder grains 6 being dispersed/inserted by actuating a vibration screen 7 are melted be ball-shaped while sinking in the heating zone 11 slowly. Furthermore, the solder grains 6 continue sinking to be solidified in the cooling layer 12, and a solder ball 13, which is 0.01 mm or more and l mm or less in diameter and 95 or more in deviation from spherical form, is accumulated at the bottom part of the melting/solidifying layer 2. After the solder ball 13 is transferred to a recovery tank 3 by actuating a screw feeder 4, it is picked up by a bucket conveyer 8 to be transferred to a recovery basket 9. Thus, a large amount of solder balls 13 with high accuracy can be manufactured inexpensively.