Title:
MANUFACTURE OF TOUCH PANEL BOARD
Document Type and Number:
Japanese Patent JPH05114769
Kind Code:
A
Abstract:
PURPOSE: To provide a method of manufacturing a touch panel board where the conduction of an electrode can be easily and surely checked and which can be lessened in fraction defective due to damage done to an electrode.
CONSTITUTION: In a manufacturing method of a touch panel board which checks electrodes 1-1, 1-2,... 1-256 in conduction properties, where the electrodes 1-1, 1-2,...1-256 are formed by laminating a transparent conductive film on an insulating board 2, the ends of the electrodes 1-1, 1-2,...,1-256 are extended and connected together in series, the electrodes 1-1, 1-2,..., 1-256 are checked in conduction, and then parts 10-1, 10-2,..., 10-256 where the electrodes 1-1, 1-2,...,1-256 are connected in series are removed.
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Inventors:
OSADA MINORU
Application Number:
JP30415691A
Publication Date:
May 07, 1993
Filing Date:
October 23, 1991
Export Citation:
Assignee:
HITACHI AIC INC
International Classes:
H01H36/00; G06F3/041; H05K1/02; H05K3/00; (IPC1-7): H01H36/00; H05K1/02; H05K3/00