Title:
MANUFACTURING APPARATUS AND ITS OPERATION METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2022126401
Kind Code:
A
Abstract:
To enable wafers to be peeled off from each other with almost no mechanical load to the laminated wafers.SOLUTION: The manufacturing apparatus comprises a storage section that stores a workpiece, a transfer section that transfers the workpiece, and a processing section that places the workpiece transferred by the transfer section and performs a peeling process. The processing section has a warm bath tank that stores liquid, a placing section that places the workpiece in the warm bath tank, and an upper arm that pressurizes the workpiece placed on the placing section.SELECTED DRAWING: Figure 1
Inventors:
KAWADAHARA SHO
Application Number:
JP2021024445A
Publication Date:
August 30, 2022
Filing Date:
February 18, 2021
Export Citation:
Assignee:
KIOXIA CORP
International Classes:
H01L21/02; H01L21/336; H01L21/677; H01L21/683; H01L27/11575; H01L27/11582
Attorney, Agent or Firm:
Hidekazu Miyoshi
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
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