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Title:
MANUFACTURING APPARATUS OF POLYSILICON AND MANUFACTURING METHOD OF POLYSILICON
Document Type and Number:
Japanese Patent JP2010037174
Kind Code:
A
Abstract:

To provide a manufacturing apparatus for obtaining high purity polysilicon at high speed.

The manufacturing apparatus 1 for polysilicon is provided with: a reaction vessel body 10 for forming a supercritical fluid state of a silicon halide compound introduced into the inside; electrodes 11, 12 which are provided inside the reaction vessel body 10 and carry out plasma discharge; a deposition member 30 which is provided inside the reaction vessel body 10 and allows silicon degraded by the plasma discharge to be deposited on a surface where the temperature is kept higher than the melting point of silicon and allows the deposited silicon to be melted; and a recovery member 32 for recovering the silicon melted on the deposition member 30.


Inventors:
WATANABE TOSHIYUKI
WATANABE EIZO
Application Number:
JP2008204599A
Publication Date:
February 18, 2010
Filing Date:
August 07, 2008
Export Citation:
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Assignee:
SILICON PLUS CORP
International Classes:
C01B33/03
Domestic Patent References:
JP2006249566A2006-09-21
JP2007126342A2007-05-24
JPS61214422A1986-09-24
JP2009299141A2009-12-24
Foreign References:
WO2005123584A12005-12-29
Attorney, Agent or Firm:
Takeshi Senda
Jiro Kobe